High strength, high electrical conductivity and thermally stable bulk Cu/Ag nanolayered composites prepared by cross accumulative roll bonding
نویسندگان
چکیده
منابع مشابه
Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding
Traditional nanostructured metals are inherently comprised of a high density of high-energy interfaces that make this class of materials not stable in extreme conditions. Therefore, high performance bulk nanostructured metals containing stable interfaces are highly desirable for extreme environments applications. Here, we reported an attractive bulk Cu/V nanolamellar composite that was successf...
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A new computational method based on MATLAB was used to study the effect of different parameters on the homogeneity of composites produced by a severe plastic deformation technique known as accumulative roll bonding. For a higher number of passes, the degree of particle agglomeration and clustering decreased, and an appreciable homogeneity was obtained in both longitudinal and transverse directi...
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Much attention has been directed recently to ultra-grain refining of metallic materials, where the grain size is reduced to less than 1 mm. It is expected that submicrometer grained structure would result in high strength and toughness at ambient temperature [1] as well as high strain rate or low temperature superplasticity at elevated temperatures [2,3]. It has been reported recently that ultr...
متن کاملFabrication of Al/Mg/Al Composites via Accumulative Roll Bonding and Their Mechanical Properties
Al(1060)/Mg(AZ31)/Al(1060) multilayered composite was successfully produced using an accumulative roll bonding (ARB) process for up to four cycles at an elevated temperature (400 °C). The microstructure evolution of the composites and the bonding characteristics at the interfaces between Al and Mg layers with increasing ARB cycles were characterized through optical microscopy, field emission sc...
متن کاملUltrahigh strength and high electrical conductivity in copper.
Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical ...
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ژورنال
عنوان ژورنال: Materials & Design
سال: 2021
ISSN: 0264-1275
DOI: 10.1016/j.matdes.2021.109455